Germany – Microelectronic machinery and apparatus and microsystems – Automated 300 mm Die-to-Wafer thermocompression bonding tool - PR1275392-3460-W
Open call for tenders published in the EU Official Journal. Closes in 29 days.
PR1275392-3460-W Automated 300 mm Die-to-Wafer thermocompression bonding tool
- Buyer
- Fraunhofer-Gesellschaft, Einkauf B12
- Country
- Germany
- Submission deadline
- 02 Dec 2026
- Contract type
- Supplies
- Sector (CPV)
- Electrical machinery, equipment and lighting
- Main CPV code
- 31712000
- Place of performance
- DED21
- Published
- 2026-11-02
- TED reference
- 756518-2026
Read the official notice on TED →
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