Germany – Laboratory, optical and precision equipments (excl. glasses) – Flip Chip Die Bonder
Open call for tenders published in the EU Official Journal. Closes in 20 days.
In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.
- Buyer
- FAIR - Facility for Antiproton and Ion Research in Europe GmbH
- Country
- Germany
- Submission deadline
- 22 Sep 2026
- Contract type
- Supplies
- Sector (CPV)
- Laboratory, optical and precision equipment
- Main CPV code
- 38000000
- Place of performance
- DE711
- Published
- 2026-08-24
- TED reference
- 582477-2026
Read the official notice on TED →
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